ESU – Technology Forum

ESU – Technology Forum


Arden Software will be at the ESU Technology Forum (The European Die-maker Association) in Luxembourg from June 2-3

We’ll be giving die-makers a glimpse into our Impact CAD/CAM Software for die-makers – and showcasing some of the new features and functionality in the pending new release.

We’ll also be demonstrating the latest version of WEBcnx – the ultimate workflow solution for the packaging sector.

Head over to the ESU website to find out more about the exhibition.

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