The Arden Software North America Team will be at Odyssey Expo 2021 taking place from May 19 -21 next year in Milwaukee
Odyssey Expo is part trade show, part educational programme targeted specifically to diecutting, diemaking, foil stamping, embossing and bindery, and Arden will be showcasing our range of packaging software solutions.
More than 50 pieces of machinery will be running demonstrations on site. Close to 100 suppliers to the industry will have booths staffed with knowledgeable experts, while more than 20 classroom sessions will teach visitors about the latest technology and help solve production problems.
Visitors can also look forward to the Techshop, which takes education one step further by simulating a working production shop floor. The Techshop hosts informative programs and hands-on teaching, with live-action video feeds that allow attendees to see all movement on the machinery up close.
Find out more on the event website.