We’re excited to announce that the Arden Software Peak Performance Conference (APPC) is back for 2026.
Our popular user conference takes place at the beautiful Sheraton Hotel in Park City, Utah, from June 14-17, bringing together packaging professionals from across the world to provide a hands-on learning and training experience for those involved in the packaging supply chain.
This isn’t just another training programme – it’s a high-impact, hands-on experience designed to elevate your skills, connect you with industry leaders, and immerse you in the full capabilities of Impact, WEBcnx, and the entire Arden software suite.
Be the first to experience two ground-breaking Arden products that will redefine packaging design and workflow automation.
Here’s what you can look forward to:
- In-depth training sessions for both designers and die-makers with Arden-supplied computers
- A robust curriculum of courses available for all experience levels, from foundational to expert
- In depth Impact Die-maker training with an emphasis on CimPACK users
- Networking with peers, developers, and integration partners
- Great food, stunning mountain views, and a little adventure
Whether you’re just getting started or have years of experience, there’s something for everyone.
More details and registration coming soon – watch this space!
